============================================================== Guild: wafer.space Community Channel: Information / general / Shared die / multi-project dice After: 08/31/2025 23:59 Before: 10/01/2025 00:00 ============================================================== [09/11/2025 04:48] algofoogle I’m only loosely thinking about this at the moment, as part of a personal interest/learning project. As such I don’t have much budget. Here are some initial thoughts though… * maybe 1mm2 area * Up to 30 digital IOs (or some mix of I, O, and IO) * probably 4 analog pins * I need bonding… COB or packaged parts * caravel is optional for me [09/11/2025 13:52] algofoogle @Essen this was meant to be a reply to you, sorry [09/13/2025 13:04] essen__ No worries. 🙂 Nice, thanks for the list. Let's see if we can get a few more people on board to help bring the cost down. [09/13/2025 13:11] essen__ Here are my initial thoughts : - ~1mm2 area - 6 pins : 4 digital ( 1 IO, 2 I, 1 O), 1 power, 1 gnd [09/13/2025 13:14] essen__ I would also need bonding, but am willing to take care of organizing and coordinating it ( have never done it ) ============================================================== Exported 5 message(s) ==============================================================